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Lead-free Package - Data of IC Package OuterLead Finish Solder plating
Composition of Lead-free solder plating
- Caution:
- SII determines solder plating composition and supplies one composition of the following Ο marks to a customer.
| Sn-Bi (2.0%) | Sn-Ag (2.5%) | Sn-Cu (2.0%) | Pd | |
|---|---|---|---|---|
| 8-pin SOP | Ο | Ο | ||
| MSOP type | Ο | Ο | ||
| SSOP type | Ο | |||
| TSSOP type | Ο | |||
| SOT type | Ο | Ο | Ο | |
| SC type | Ο | Ο | ||
| SON type | Ο | Ο | ||
| SNT type | Ο | |||
| 8-pin DIP | Ο | |||
| TO-92 | Ο(0<Cu≤1.4%) |
Reflow Temperature Profile in Soldering Heat Resistance Test
Preprocessing conditions
Note: Other Reflow Temperature Profiles are under development. The right Temperature Profile shows maximum characteristics. Actual characteristics of recommended profile may differ from the right chart. |
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Melting point
Solderability
Solder Joints Exfoliate Strength
- Solder paste composition: Sn-3.0Ag-0.5Cu
- Red line on graphs: The standard of the intensity indicated by EIAJ-ET7403.
