Package

Micro Package Solution – SNT Package (Small Outline Non-leaded Thin Package)

Employment of a newly developed ultra-small SNTpackage realizes a much smaller mounting space compared with conventional products, enabling high-density mounting. The SNT-6A(H) package also realizes a power dissipation of 500 mW.

SNT4Aパッケージ SNT6Aパッケージ SNT8Aパッケージ
SNT-4A SNT-6A, SNT-6A(H) SNT-8A
1.2×1.6×0.5t mm 1.57×1.8×0.5t mm 1.97×2.46×0.5t mm

 

Features of SNT

Package code SNT-4A SNT-6A SNT-6A(H) SNT-8A
Number of pins 4 6 6 8
Sealing resin Epoxy Epoxy Epoxy Epoxy
Dimensions / mm 1.2 × 1.6 × 0.5t max. 1.57 × 1.8 × 0.5t max. 1.57 × 1.8 × 0.5t max. 1.97 × 2.46 × 0.5t max.
Pin pitch / mm 0.65  0.5 0.5 0.5
Pin surface processing Sn 100% Sn 100% Sn 100% Sn 100%
Mass (mg) 2.4 3.6 3.5 6.9
Power dissipation (mW) 
(when mounted on board)*
300 400 500 450
Reliability test level JEDEC Level 1 JEDEC Level 1 JEDEC Level 1 JEDEC Level 1
Flame retardant UL94-V-0 UL94-V-0 UL94-V-0 UL94-V-0

Note: Power dissipation data on board are to be obtained.