Seiko Instruments Inc. recommends the reflow method using far- and middle-infrared radiation plus panel heater. Figure 1 shows an example of recommended temperture profile for infrared reflow.

Figure1 Recommended temperature profile of infrared reflow

* Number of reflow cycle : Twice for SOT, SOP, SSOP, TSSOP, MSOP, SC-82AB, SC-88A, SON

Solder dipping gives larger thermal stress to packages compared to infrared reflow. Preheating is indispensable to relax the thermal stress. Figure 2 shows an example of recommended temperture profile of solder dipping.

Figure 2 Recommended temperature profile of solder dipping