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Micro Package Solution - WLP Package (Wafer Level Package)
Ultra-small WLP package realizes a much smaller mounting space compared with conventional products, enabling high-density mounting.
· For voltage regulator IC and EEPROM IC
· 0.5 mm bump pitch for mount-ability
Mounting Volume Ratio
Specifications
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|
<WLP-4B>
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 |
 |
Specifications (mm)
(including bumps)
|
1.16×0.79×0.58 max.
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Bump pitch (mm)
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0.5
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|
Bump diameter(µm)
|
200
|
|
Bump material
|
Pb free solder
|
|
Marking(on Si face)
|
Laser
|
|
Package for delivery
|
Carrier tape
|
|
 |
Specifications (mm)
(including bumps)
|
1.66×1.21×0.60 max.
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|
Bump pitch (mm)
|
0.5
|
|
Bump diameter(µm)
|
250
|
|
Bump material
|
Pb free solder
|
|
Marking(on Si face)
|
Laser
|
|
Package for delivery
|
Carrier tape
|
|
 |
Specifications (mm)
(including bumps)
|
1.66×1.15×0.60max.
|
|
Bump pitch (mm)
|
0.5
|
|
Bump diameter(µm)
|
250
|
|
Bump material
|
Pb free solder
|
|
Marking(on Si face)
|
Laser
|
|
Package for delivery
|
Carrier tape
|
|
